• Available for ceramic, plastic BGA and land grid array LGA
    • Screw lock compression type socket guarantees contact continuity even under the highest shock and vibration
    • Thru-hole version eliminates surface mount soldering problems
    • Easily exchange and replace chips with no desoldering required
    • Utilizes solder paste or solder flux and industry standard rework stations
    • Prevents time-consuming board revisions
    • Customs available upon request
    • Development
    • Debug
    – Hand Test
    • Programming / Test
    – Qualification
    – Production

Technical Specification

  • Please refer to the datasheet for model specific technical data