Description

BGA FPA Flat PIn Array
Very low inductance
• Protects valuable PC boards and subjects device
to lower thermal stress
• Same footprint as BGA device
• Compact & easy to integrate into designs
• Solder your BGA chip to the FPA for multiple
insertions into a surface mount BPE
• Customs available upon request
APPLICATIONS
• Development
• Debug
– Hand Test
• Programming/Test
– Qualification
– Production

Technical Specification

  • Please refer to the datasheet for model specific technical data