Description

  •  Data rate performance per differential pair with standard ERmet ZD male connector max. 15 Gbit optional with ERmet ZDplus male connector 20 Gbit+
  • 40 differential pairs per inch
  • Mating compatible to standard ERmet ZD male connectors, backwards compatible to existing backplane systems
  • Improved crosstalk behaviour
  • Improved layout on daughter cards
  • Meets the performance requirements of next generation processor technology

Technical Specification

  • Temperature Range:   -55 to  125°C
  • Mechanical operation:   >250 mating cycles
  • Housing material:   LCP 
  • Base material:   Cu alloy
  • Mating area:   Min:0.65um PdNi + 0.1um Au over 2-3um Ni