Description

  • 170-poles high speed signal connector for card edge mount of AMC modules into the backplane.
  • Data transfer up to 12,5 Gbps.
  • Internal shielding base for improved performance.
  • “Eye of the needle press fit contacts.

Technical Specification

  • Housing Material: Liquid Crystal Polymer LCP, UL 94-V0
  • Contact Material: Material: Copper alloy.Finish: Mating area Au over Ni. Termination: SN over Ni.
  • Current Rating IEC 60512: 0,4 A min.
  • Current Rating: Ground contacts: 0,3 A min.Power contacts: 1,52 A min.Differential pair contacts: 0,1 A min.
  • Contact Resistance: 25 M Ohm
  • Insulation Resistance: 100 M Ohm
  • Differential Impedance: 100 Ohm + / – 10%
  • Crosstalk: 3% Multi aggressor condition
  • Differential skew: < 5 ps
  • Mating Cycles: 200
  • Mating Force: 100 N max.
  • Withdrawal Force: 65 N max.