Description

   Anisotropically conductive polymer fabric with
multiple conductive elements per interface for outstanding
electrical performance
• Electrical performance tested to 40 GHz
• Self-registering, compliant material eliminates a
whole level of tolerance stack-up and makes implementation
easy
• Reduces costs/labor; no need for precision alignment
of contacts
• Robust, durable interface material that is extremely
stable
• Ideal for high-density, high reliability interconnections
with capabilities to 0.1mm interfaces
• Excellent alternative for testing fine-pitch chip
packages and bare boards with surface-mount pads
• Allows for non-planar interconnections; easily cut
or molded to accommodate varying dimensional
sizes and geometric configurations

  • APPLICATIONS

    • High Speed Test and

    Development

    • High Speed Test &

    Burn-in

    • Production Sockets

    • Board to Board

    Connectors

    • Cable to Board

    Connectors

Technical Specification

  • Please refer to the datasheet for model specific technical data