• The pre-alignment module is a solution for the dilemma posed by high pin-count hard-metric connectors and the need for precision connector mating combined with sufficient play between subrack guide rails and printed-circuit board cards.
  • The pre-alignment module consists of solid metal guides that offer several optional functions:Eg. The electrical contact model. Shielding is low resistant because of the gold plating and therefore allows extra current to flow with 40A at 20ºC through a large diameter. This large pin diameter enables a wide capture range of >2mm. The PCB is adequately centred and guided as a result.

Technical Specification

  • Fastening: The pre-alignment pin with fastening thread is fastened on the backplane and is available for PCB thickness of 2.5 to 6mm, and 6 to 8mm.
  • Guide Bush: The guide bush is mounted on the daughter card with an M4 or M5 screw.
  • PCB Thickness: The PCB thickness for the daughter card can be 1.6 to 3.5mm, or 3.5 to 5.5mm.
  • Catalogue PDF: Please refer to catalogue pdf for further information.